About RCT
Nanjing Ree-chip Top Electronic Technology Co., Ltd. was established on January 22, 2021. The company is located in Pukou Economic Development Park, Nanjing City, Jiangsu Province, adjacent to the Yangtze River and the Laoshan Forest National Park. It has a total investment of 880 million RMB and covers an area of nearly 5,100m², including a clean room of 4,100m².
Technology
The process of installing, fixing and connecting the semiconductor chip and the ceramic shell to form a three-dimensional structure through the micro-connection technology, mainly through the process of chip loading, bonding, capping and other processes to realize the conversion of the chip to the electronic device.
The process of mounting, fixing and connecting semiconductor chips and metal frames or plastic substrates to form a three-dimensional structure through micro-connection technology.
The interconnection between the chip and the substrate is through solder ball bumps instead of bonding wires, and the chip electrodes face down through reflow soldering to interconnect the bumps and the package substrate. Flip chip assembly welding technology (also known as C4 technology: controllable collapse chip connection technology), different from the traditional interconnection through wire bonding, flip chip through bumps and the substrate after high temperature welding to form interconnection, and then achieve electrical conduction. .
Passive devices, multiple functional chips, including processors, memory and other functional chips are integrated into one package, thereby realizing a basically complete functional device.
Special device packaging technology
Including CMOS image sensor packaging technology, RF chip packaging technology, high-power device packaging technology, MEMS packaging technology.
Service
FC/SIP package
Fast packaging
Reliability test and inspection
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Company Culture
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Talent Recruitment
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Welfare Treatment
Young and dynamic teamHuge space for innovation, encourage every creativity Join Us+
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