Plastic Packaging Tech
By the assembly process flow including die attach on organic substrate or lead-frame, wire bonding , and molding etc., the chip is encapsulated in the plastic package, the evolution from the bare die to high reliability plastic device is accomplished. Leadframe Package：SOP，MSOP，SSOP，TSSOP，DFN，QFN, QFP Substrate Package: LGA, BGA, FC-BGA
MORE +Technical Advantages
RCT provides a full range of high quality plastic packaging solutions, including leadframe packaging and substrate packaging, by systematic design and simulation, selection of full qualified integration processes, and the use of automated process system to ensure the product quality.
Related Technology
Ceramic Packaging Technology
Ceramic packaging is to assemble the produced integrated circuit chip on a ceramic shell carrier such as alumina, aluminum nitride, etc., and realize signal extraction through bonding, and seal it through a cover plate to form a whole.
Flip Chip Technology
Chip-to-substrate interconnection via micro-assembly via bumps instead of wire bonds can provide high-density interconnects and effectively reduce package parasitics.
System-in-Package Technology
Multiple active and passive components with different functions, as well as MEMS or optical devices, are assembled into one package, thereby realizing a heterogeneous complex package structure with the functions of a system or subsystem.
Special Device Packaging Technology
Including CMOS image sensor packaging, RF chip packaging, MEMS packaging and other technologies.
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