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Ree-Chip Top

Turnkey Service


Ruixinfeng combines its own technological characteristics to provide customers with ceramic shell / substrate / frame design and simulation services.

Design

Ree-Chip Top

• Ceramic / Plastic substrate layout
• Package design

 

Structure Simulation

Ree-Chip Top

• Structure Simulation

• Warpage

 

 

Electrical Simulation

Ree-Chip Top

• SI PI
• Time Domain

• EMI

Thermal Simulation

Ree-Chip Top

• Thermal resistance 
• Isotherm

 

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