Flip-chip / SiP Packaging
Ruixinfeng has built advanced FC process line and sip process line. FC process can realize high-precision mounting within 50000 bumps of a single chip, full-automatic zero emission cleaning and bottom filling with ultra-low porosity. SIP packaging process can realize the integration of different components, fc+wb+smt, and is equipped with flying needle tester, which can immediately test key nodes in the packaging process, helping to improve the packaging yield.
Fc/sip typical process
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