Single channel service
While providing full process packaging services, ruixinfeng also provides customers with processing services of single process of packaging, including thinning, gold backing, dicing (single variety and MPW), wire bonding, capping, marking, pin molding, flip chip welding, ball / column planting, etc.
Design & Simulation
Design
Structure Simulation
Electrical Simulation
Thermal Simulation
Packaging
Wafer Grinding /Back Metallization/Dicing
Die Attach (Epoxy/Eutectic)
Wire bond (Gold/Aluminum wire)
SMT (Flip chip/SMD)
Molding
Sealing (Alloy/Parallel seam sealing)
Trim & Form
Mark (Laser/Ink)
Ball/Column Mounting
Failure Analysis & Reliability Tests
Failure Analysis
Hermetic test
Precondition
Moisture Sensitivity Level (MSL)
Highly Accelerated Stress Test (uHAST)
Pressure Cooker Test (PCT)
Thermal Shock Test (TST)
Temperature Cycling Test (TCT)
We firmly believe that: stable process casting high-quality products
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● conductive adhesive bonding
● insulation adhesive bonding
● eutectic welding
● silver glass sintering
Bonding
● gold wire ball welding
● gold wire wedge welding
● silicon aluminum wire wedge welding
● rough aluminum wire wedge welding
Capping
● alloy sealing (Vacuum & nitrogen)
● parallel seam welding
● glass sealing
● adhesive
Molding
● pressure injection molding
● flexible small batch
● low moisture absorption materials
Flip
● Cu pillar bump
● solder ball bump
● low porosity filling
● OS test
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