Ceramic Packaging Tech
By the assembly process flow including die attach, wire bonding and sealing etc.，the chip is sealed in the ceramic package, the evolution from the bare die to high reliability ceramic device is accomplished. Ceramic Package: CDIP，SOT，TO，CLCC，CQFN，CSOP，CFP，CQFP，CPGA，SPGA，CLGA，CBGA，CCGA
MORE +Technical Advantages
The ceramic package can provide the seal protection of the IC chip, with the advantage of high temperature resistance, good chemical stability, high mechanical strength & thermal conductivity, which can fulfil the high reliability requirements. RCT can provide one-stop service for ceramic packing, by mature packaging technology, advanced equipment, cleanliness control, and systemic processes control, to ensure the high quality & high assembly yield.
Related Technology
Plastic Packaging Technology
Plastic packaging is to assemble the produced integrated circuit chip on a carrier such as a lead frame or an organic substrate, and realize signal extraction through bonding, and form a whole through resin encapsulation.
Flip Chip Technology
Micro-assembly of chip-substrate interconnection through bumps instead of wire bonds can provide high-density interconnects and effectively reduce package parasitics.
System-in-Package Technology
Multiple active and passive components with different functions, as well as MEMS or optical devices, are assembled into one package, so as to realize a heterogeneous and complex package structure with the functions of a system or subsystem.
Special device packaging technology
Including CMOS image sensor packaging, RF chip packaging, MEMS packaging and other technologies.
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