High-reliability Plastic Packaging
Ruixinfeng adopts an innovative compatible mold design to reduce the input cost, and at the same time, provide packaging processing services for more customers who need the number of small and medium-sized packages. The packaging forms include frame plastic packaging, such as SOP, SOIC, TSOP, tssop, qfn/dfn, as well as substrate plastic packaging LGA, BGA, etc. the quality grade can meet the requirements of gjb7400 N1 and N at the highest.
Substrate Package
LGA, BGA, FC-BGA
Leadframe Package
SOP，MSOP，SSOP，TSSOP，DFN，QFN, QFP
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