Flip-chip Packaging Tech
Flip Chip is an ideal interconnect bonding technology. The chip is directly attached on the substrate in a face-down way using solder bumps or Cu pillar instead of wire bonds, provides the shortest electrical path with high electrical and thermal performance. To meet the growing demand for electrical performance, high I/O and high system reliability products.
MORE +Technical Advantages
RCT provide turnkey packaging solutions for High-End Flip-chip products, with high-efficiency automated, intelligent production lines and great factories.
Related Technology
Ceramic Packaging Technology
Ceramic packaging is to assemble the produced integrated circuit chip on a ceramic shell carrier such as alumina, aluminum nitride, etc., and realize signal extraction through bonding, and seal it through a cover plate to form a whole.
Plastic Packaging Technology
Plastic packaging is to assemble the produced integrated circuit chip on a carrier such as a lead frame or an organic substrate, and realize signal extraction through bonding, and form a whole through resin encapsulation.
System-in-Package Technology
Multiple active and passive components with different functions, as well as MEMS or optical devices, are assembled into one package, thereby realizing a heterogeneous complex package structure with the functions of a system or subsystem.
Special Device Packaging Technology
Including CMOS image sensor packaging, RF chip packaging, MEMS packaging and other technologies.
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