SiP Packaging Tech
SiP Packaging (System in Package) integrates passive components and multiple functional chips, including processors, memory & etc. into one package to achieve a complete function. SiP packaging has the advantage characteristics including high packaging efficiency, small package size, and low system cost.
MORE +Technical Advantages
With a fast development cycle, more functions, lower power consumption and better performance, System in Package (SiP) has become the most mainstream packaging solution RCT promotes the applications of ceramic packaging and high-rel plastic packaging in automotive electronics field, to ensure the high reliable performance. In addition, technologies such as vehicle gauged flip-chip packaging , system-in-package (SiP) are also available.
Related technology
Plastic Packaging Technology
Plastic packaging is to assemble the produced integrated circuit chip on a carrier such as a lead frame or an organic substrate, and realize signal extraction through bonding, and form a whole through resin encapsulation.
Flip Chip Technology
Chip-to-substrate interconnection via micro-assembly via bumps instead of wire bonds can provide high-density interconnects and effectively reduce package parasitics.
陶瓷封装技术
陶瓷封装就是把生产出来的集成电路芯片组装到氧化铝、氮化铝、等陶瓷外壳载体上，并通过键合实现信号引出，经盖板密封形成一个整体。
特种器件封装技术
包括CMOS图像传感器封装、RF芯片封装、MEMS封装等技术。
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