Special Device Packaging Tech
Special device packaging technology for image sensors, RF modules, power devices and MEMS.
MORE +Technical advantages
RCT provides one-stop solutions for special device based on product characteristics.
Related technology
Plastic packaging technology
Plastic packaging is to assemble the produced integrated circuit chip onto the lead frame or organic substrate and other carriers, and realize signal extraction through bonding, and form a whole through resin encapsulation.
Flip Technology
The interconnection between chip and substrate can provide high-density interconnection and effectively reduce package parasitic effects by micro assembly through bumps rather than bonding wires.
System level packaging technology
Multiple active and passive components with different functions, as well as MEMS or optical devices, are assembled into a package, so as to achieve a heterogeneous complex package structure, with the function of a system or subsystem.
Ceramic packaging technology
Ceramic packaging is to assemble the produced integrated circuit chips onto alumina, aluminum nitride, and other ceramic shell carriers, and realize signal extraction through bonding, which is sealed by the cover plate to form a whole.
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