packaging process engineer
Job Responsibilities
1. Responsible for the support and verification of semiconductor packaging processes (such as backside gilding, airtight caps, molding trimming, laser and ink marking, etc.);
2. Responsible for packaging process control, improve packaging yield and production efficiency, and deal with abnormal production lines;
3. Compilation of relevant guidance documents such as work instructions and inspection standards;
4. The work requirements temporarily arranged by the superior leadership.
Job requirements
1. Bachelor degree or above, major in material chemistry/semiconductor/mechanical automation;
2. More than 3 years of relevant work experience in semiconductor packaging technology is preferred;
3. Possess certain English reading and writing skills.
Job Application
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